Senior PCB Fabrication Engineer Qorvo supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo is looking for a PCB Fabrication Engineer with knowledge in PCB and/or IC Substrate manufacturing process for RF product applications. The technology needed in the quickly changing RF market require that packaging innovation provide the business a strategic advantage. The ideal candidate will utilize their broad PCB manufacturing experience to work with our suppliers in developing new substrate technologies for next generation product / technology requirements from concept to high volume manufacturing.
Responsibilities include:
Interface between Qorvo design community and worldwide supply base to create technology roadmaps to support future products. Develop, qualify, and support clean launch of new PCB material sets, design rules, capabilities, and suppliers in line with centralized Qorvo processes and documentation standards. Design material and surface finish evaluations using screening tests and design of experiments to improve product attributes such as RF performance, MSL rating, lower cost, or size reduction. Utilize program management methodology to plan, execute, and monitor complex process and/or product development projects. Apply problem-solving skills and knowledge to solve challenges related to new technologies or improve existing supply chain capabilities. Travel to PCB suppliers to provide technical support for technology development, supplier qualification, and problem resolution.
Required Skills:
Learn fast in a high-paced environment Strong communication skills Industry knowledge and experience with PCB manufacturing, including processes such as via drill, Cu pattern plating, panel plating, surface finishes, etc. Familiarity across a wide range of assembly/packaging process technologies and materials such as SMT, Die Attach, Wire Bond / Flip Chip, Molding, Multi-layer laminates, etc. is a plus. Recognized understanding of IPC laminate/PCB standards Experience in developing design rules Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g. DMAIC, 8D). Understanding of Design for Manufacturability and requirements needed to ramp technologies in a high-volume manufacturing environment. Experience with Altium, KiCAD, Cadence, or other PCB design software Effective project management skills Proven record of accomplishment in supporting New Product / Processes and/or Technology through innovative packaging solutions
Required Experience:
5+ years of experience or an equivalent combination of advanced degree and education in PCB manufacturing Bachelor's or higher degree in Chemistry or Engineering disciplines
Job Location:
This is an onsite position where the expectation is to be onsite five days a week. This position can be located at our offices in Greensboro NC, Richardson TX or Apopka FL. This position is not eligible for visa sponsorship by the Company. Make a difference at Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us. We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.
