Senior Director, Chiplet Packaging & FCBGA Programs

Amkor Technology, Inc. in Tempe, AZ seeks a Senior Director, Chiplets/FCBGA Business Unit to lead a team of BU engineers responsible for program management of advanced packaging solutions, including chiplet-based IC packages, High Density Fan-Out (HDFO), and other advanced package technologies supporting computing, networking, and mobile markets. This role serves as the primary business unit leader for strategic Tier 1 customer programs, partnering with Amkor's R&D organization in South