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Principal Thermal Architect — AI Compute & Packaging at qualcomm |...

Principal Thermal Architect — AI Compute & Packaging

qualcommSan Diego, CA

$160,000 - $240,000 per year

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Principal Thermal Architect — AI Compute & Packaging

qualcommSan Diego, CALead L6

$160,000 - $240,000 per year

Mechanical Engineers Engineers, All Other Computer Hardware Engineers

Air-Conditioning and Warm Air Heating Equipment and Commercial and Industrial Refrigeration Equipment Manufacturing Electronic Computer Manufacturing Heating Equipment (except Warm Air Furnaces) Manufacturing

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Qualcomm Technologies, Inc. is seeking a Principal Thermal Engineer to solve complex thermal challenges and enable leading performance for the Dragonfly AI300 platform and future AI computing platforms. You will work on cutting-edge thermal architecture, simulation, validation, and optimization with cross-functional teams across silicon, packaging, hardware, and system engineering. You will lead thermal design reviews, perform CFD analyses, and communicate results to stakeholders, driving

Matching similar jobs

Level

Lead L6

Salary

$160,000 - $240,000 per year

Location

San Diego, CA

Occupation

Mechanical Engineers

Industry

Air-Conditioning and Warm Air Heating Equipment and Commercial and Industrial Refrigeration Equipment Manufacturing

Posted

2 days ago

APPLY NOW (opens in a new tab)