3DIC Wet & Plating Tech Lead for Advanced Packaging
intelHillsboro, IL
3DIC Wet & Plating Tech Lead for Advanced Packaging
intelHillsboro, ILManager L7
Computer and Information Systems ManagersFoundry Mold and CoremakersSemiconductor Processing Technicians
Semiconductor and Related Device ManufacturingSemiconductor Machinery ManufacturingSoftware Publishers
APPLY NOW (opens in a new tab)Intel Foundry is seeking a Wet and Plating Module Development Manager to lead Wet Etch/Clean and Plating technology development for 3DIC platforms. This role manages a team of process engineers while contributing technically to process optimization.
The successful candidate will shape the technology roadmap, drive production-ready processes for high-volume manufacturing, and collaborate across functions to enable manufacturing excellence and seamless technology transfer.
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Level
Manager L7
Location
Hillsboro, IL
Occupation
Computer and Information Systems Managers
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday