Package Designer
Location: San Jose CA / Chandler AZLongterm Contract
Client: Tessolve(Implementation)
Visa:
No OPTWe are looking for an experienced packaging designer to develop creative and cost-effective packaging designs.
Job Description:- Netlist creation, BGA creation as per the inputs
- Conduct feasibility studies to advise optimum pad layout, interconnect types and substrate parameters for a specific IC device or application.
- Define substrate stack-ups, routing strategies and via structures.
- Substrate design experience for RF, digital, high-speed and mixed signal die
- Excellent understanding of SI/PI requirement for routing HSIO (DDR, SERDES, etc).Good experience in UCIE-Advanced and Standard technology, HBM technology.
- Experience in setting design rule checks (DRC) to ensure layouts meet specific manufacturing, Assembly and design guidelines.
- Experience of optimise the die breakout for signals and create patterns for High power.
- Strong understanding of HDI substrate technologies, layout design rules, and materials for optimal performance. Verify designs against electrical, thermal, mechanical, and manufacturability requirements.
- Knowledge on different Package types.
- Experience in Wire bond, Flip chip Substrate designs.
- Hands on experience with Wire bond, Flip chip & advanced packaging technologies (2.5D, 3D, RDL, embedded passives, etc.)Strong experience with CoWoS (Chip-on-Wafer-on-Substrate) interposer design and the impact of the substrate design to support CoWoS.Knowledge of different OSAT design rules
- QualificationBachelor's degree in Electronics /Electrical Engineering,3 to 8+ years in IC package design and development.
- Proficiency with Cadence Allegro Package Designer.
