Senior ASIC Package Design Lead - High-Speed SerDes

Broadcom Inc. in Fort Collins is seeking an experienced IC Package Design Project Manager to lead a team of engineers delivering flip-chip-BGA packages for high-speed SerDes and high-power ASICs, including AI, HPC, and 5G applications. You will create and track project plans for 20+ concurrent designs, improve scheduling, organize cross-functional activities, and communicate plans, status, and risks. A strong background in package design, SI/PI, and design for manufacturability is required.