Senior Photonic Packaging Engineer - SiPh & HI Integration

GlobalFoundries in Vermont, Essex Junction, seeks a Photonic Packaging Engineer to lead the development and sustainment of advanced optical packaging for Silicon Photonics (SiPh) and co-packaged optics (CPO). You will collaborate across photonics, electrical, mechanical and manufacturing teams to deliver scalable, low-loss packaging architectures with 2.5D/3D integration, fiber attach, and reliable thermal/mechanical integration.