SK Hynix Memory Solutions At SK hynix memory solutions, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in NAND flash technology and memory solutions, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape. We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix memory solutions, you will be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.
About the Role:
Join our Physical Design(SoC Integration) team responsible for delivering high-performance SoC designs from RTL to GDS. As a Sr. Staff Physical Design Engineer, you will lead physical implementation efforts for advanced-node designs, driving critical blocks through synthesis, placement, CTS, routing, and signoff. You will work closely with front-end, DFT, power, and analog teams to optimize PPA (Power, Performance, Area) while ensuring silicon success. This role requires deep hands-on expertise across the full physical design flow as well as leadership to mentor junior engineers and define methodologies for the team.
Responsibilities:- Lead physical design implementation from synthesis through GDS for high-performance blocks or full-chip SoC designs in advanced process nodes (7nm, 5nm, 3nm)
- Execute and optimize synthesis, placement, clock tree synthesis (CTS), and routing using industry-standard P&R tools (Synopsys ICC2/Fusion Compiler or Cadence Innovus)
- Drive timing closure and signoff using PrimeTime (PT), including advanced analysis such as SI, AOCV/POCV, crosstalk, and ECO implementation
- Perform RC extraction using StarRC or Quantus and ensure strong correlation between extraction and STA results
- Own physical verification signoff with Mentor/Siemens Calibre, resolving DRC, LVS, ERC, and antenna violations in complex FinFET layouts
- Conduct power integrity analysis using Ansys RedHawk(Redhawk-SC), including static/dynamic IR drop and EM analysis; implement power grid and decap optimizations
- Develop and maintain physical design flows and automation scripts (Tcl, Perl, Python), mentor junior engineers, and collaborate with cross-functional teams to achieve tapeout schedules
Minimum Qualifications:- Bachelor's degree in Electrical Engineering, Computer Engineering, or related field (Master's preferred)8+ years of hands-on experience in ASIC physical design with proven tapeout success
- Expert-level proficiency in synthesis, placement, CTS, and routing using Synopsys or Cadence P&R tools
- Deep knowledge of static timing analysis (STA) and PrimeTime signoff, including multi-corner/multi-mode closure
- Demonstrated experience with physical verification using Calibre (DRC, LVS, ERC) and IR drop/EM analysis using RedHawkPreferred Qualifications
- Experience at 5nm or 3nm process nodes with FinFET and multi-patterning design rules
- Familiarity with low-power design techniques including UPF, clock gating, multi-Vt, and voltage islands
- Strong programming skills in Tcl, Perl, and Python for flow automation and data analysis
- Knowledge of ECO implementation and clock reconstruction (CRPR, useful skew) methodologies
- Experience leading or mentoring a team of physical design engineers on complex SoC projects
- Exposure to memory-centric interfaces and systems such as SSD SoC, HBM, or HBF (High Bandwidth Flash) base die designs (a plus, not required)
- Familiarity with chiplet and die-to-die (D2D) interconnect technologies, including Universal Chiplet Interconnect Express (UCIe) or equivalent D2D PHY protocols (a plus, not required)
Compensation:
$160,000/yr - $220,000/yrSK hynix memory solutions America Inc. offers you the opportunity to apply your skills to exciting projects while working with innovative teams. Our compensation package is complimented by a generous benefits package including medical, dental, vision, life insurance and a company 401(k) match, as well as cafeteria, onsite gym and much more. If you are motivated by technical challenges, we offer a collaborative work environment that encourages career growth. The salary offered to a selected candidate will be tailored based on several factors, including the location, job grade, relevant knowledge, skills, and experience. We also take into account the internal equity among our current team members to ensure fairness and competitiveness.
