Field Service Engineer – Semiconductor Equipment (300 mm / High-Pressure Anneal)
Location: Arizona, United States
Employment Type: Full-time
Travel:
Approximately 30%HPSP is a leading manufacturer of semiconductor capital equipment. We design and support high-pressure annealing systems used in advanced semiconductor manufacturing. We are seeking a hands-on Field Service Engineer to install, maintain, troubleshoot, and improve the reliability of 300 mm high-pressure annealing furnace systems at customer facilities. This is a customer-facing role for an engineer or experienced technician who enjoys solving complex electromechanical problems, working safely in a fab environment, and building trusted relationships with customers and internal technical teams.
What You'll Do:
Install, commission, test, and support HPSP semiconductor equipment at customer sites.
Perform scheduled preventive maintenance, corrective maintenance, troubleshooting, repair, and recovery activities on complex 300 mm high-pressure annealing systems.
Diagnose issues across electrical, electronic, mechanical, pneumatic, vacuum, heating, gas-delivery, factory-automation, wafer-transfer, and safety-interlock subsystems.
Use schematics, technical documentation, logs, test equipment, and structured troubleshooting methods to identify root causes and restore tool operation.
Complete timely, accurate field-service reports, maintenance records, technical reports, and documentation required for system reliability tracking and customer billing.
Communicate equipment status, technical findings, risks, and recovery plans clearly to customers, site leadership, and HPSP support teams.
Support equipment installations, upgrades, qualifications, and customer acceptance activities.
Provide technical guidance and training to customers and other field-service personnel as appropriate.
Capture recurring issues, documentation gaps, and improvement opportunities; provide feedback to engineering, product-quality, and service teams.
Travel on short notice when needed to support customers and fellow field-service engineers.
Work Schedule:
This position is based at a customer manufacturing facility and normally follows a Monday–Friday day-shift schedule. Compressed workweeks, occasional overtime, and off-hours support may be required to meet customer and equipment needs.
Minimum Qualifications:
Associate degree or technical certification in electronics, electromechanical technology, mechatronics, automation, or a related discipline; equivalent relevant experience will be considered.
Hands-on troubleshooting experience with complex electrical, mechanical, pneumatic, vacuum, robotic, automation, or process equipment.
Ability to read and apply electrical schematics, mechanical drawings, technical procedures, and equipment documentation.
Strong diagnostic, analytical, and problem-solving skills.
Comfortable using standard hand tools and electrical/electronic test equipment.
Clear written and verbal communication skills and a professional, customer-focused approach.
Ability to work effectively both independently and as part of a cross-functional service team.
Strong ownership, integrity, attention to detail, and commitment to safe work practices.
Ability to travel approximately 30%.
Preferred Qualifications:
Field-service, maintenance, installation, or sustaining-engineering experience in semiconductor manufacturing or another high-technology industrial environment.
Experience supporting 300 mm semiconductor equipment, batch furnaces, thermal systems, vacuum systems, gas-delivery systems, robotics, or factory automation.
Experience with high-pressure systems, high-temperature furnaces, wafer handling, PLC-controlled equipment, or semiconductor safety practices.
Familiarity with customer-fab work environments and documentation requirements.
Join HPSP and help deliver reliable, responsive support for advanced semiconductor manufacturing equipment while building deep technical expertise in high-pressure annealing technology.
