Senior Packaging Engineer, AI Accelerator Systems

Annapurna Labs designs silicon and software that accelerate innovation for AI accelerators and cloud solutions. The Packaging Technology Development team leads the packaging, substrate/PCB, interposer, and assembly work for next‑generation Trainium systems, collaborating with silicon, board, system, and supply chain teams to bring bleeding‑edge AI hardware from concept to volume production. The team seeks engineers who can optimize cost, yield, warpage, and reliability while driving new