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Job Title: Physical Design Engineer
Job Summary: We are seeking an experienced Physical Design Engineer to lead and implement physicaldesign across a range of high-volume consumer devices and satellite-related projects. This roleinvolves end-to-end physical implementation, collaboration with cross-functional teams, andownership of physical design methodologies and timing closure.
Key Responsibilities:
  • Lead and implement physical design for chips across process nodes ranging from 40nmto 7nm
  • Perform block-level and top-level physical implementation
  • Drive floorplanning activities including multi-power domain design, power grid (PG)planning, block shaping, and clock tree implementation
  • Interface with internal and external stakeholders, including Design, IP, and Library teams
  • Conduct physical verification at block and chip level
  • Perform static and dynamic IR drop analysis, as well as signal and powerelectromigration (EM) checks
  • Develop methodologies and flows for physical design and timing closure
  • Collaborate with Synthesis, STA, and RTL design teams to meet physicalimplementation and power intent requirements
  • Support ESD, IO padring, and analog integration; experience with packaging types suchas flip-chip and WLCSP is preferred
Required Qualifications:
  • Bachelor’s degree in Electrical Engineering with 8+ years of experience, OR Master’sdegree in Electrical Engineering with 10+ years of experience
  • Multiple tapeout experience
  • Extensive hands-on experience with tools such as Innovus, VCLP, Formality, LEC, Calibre, and timing closure tools
  • Strong expertise with Cadence Innovus (required)
  • TCL scripting experience (required); Python is a plus
  • Knowledge of physical design flows and methodologies

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Level

Lead L6

Location

Honolulu, HI

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Electronics Engineers, Except Computer

Industry

Semiconductor and Related Device Manufacturing

Posted

2 days ago

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