Cryogenic Quantum Bump Integration Engineer

GlobalFoundries U.S. Inc. in Essex Junction, VT is seeking a skilled R&D bump process engineer to join the Quantum Advanced Packaging team. You will own development and integration of cryogenic, superconducting bumping processes enabling scalable quantum hardware packaging. The role involves leading cryogenic bump tech development, defining process flows, optimizing structures, and coordinating with device/qubit, cryogenic system teams, packaging & assembly teams, modeling and reliability teams,