Microelectronics Manufacturing/Process Engineer
Location:
Chatsworth, CA 91311 Salary Range: $85,000–$105,000 per year Position Type: Full Time Shift: 1st Shift Category: Engineering Due to ITAR and/or CUI Compliance, This Position Requires Candidates to Be U.S. Citizens.
Position Overview:
We are seeking a hands-on Microelectronics Manufacturing/Process Engineer to support, troubleshoot, develop, maintain, and improve manufacturing processes in a high-reliability microelectronics and electronics manufacturing environment. The primary focus of this position is hands-on microelectronics and hybrid assembly process engineering, including epoxy dispensing, die attach, wire bonding, wire-bond pull testing, flip-chip, hybrid assembly, ceramic substrates, and underfill/encapsulation. The position will also support SMT, PCB assembly, soldering, inspection, and related electronic manufacturing processes. The ideal candidate will have direct manufacturing/process engineering experience in high-reliability microelectronics, hybrid microcircuits, semiconductor packaging, or similar technologies, preferably in aerospace, defense, medical, industrial, or other highly regulated manufacturing environments. Experience with applicable military microelectronics standards is highly valued, particularly MIL-STD-883, MIL-PRF-38534, MIL-PRF-38535, Class H and Class K requirements, and MIL-PRF-19500.The engineer will work closely with Production, Engineering, Quality, Supply Chain, operators, technicians, and equipment/material vendors to troubleshoot manufacturing issues, optimize processes, improve yields, reduce defects, qualify new processes and equipment, and drive continuous improvement.
Essential Duties & Responsibilities:
Develop, support, troubleshoot, maintain, and optimize microelectronics, hybrid, and electronic assembly manufacturing processes.
Provide hands-on process engineering support for:
- Epoxy dispensing
- Die attach
- Wire bonding
- Wire bond pull testing
- Flip-chip assemblyHybrid microelectronic assemblyCeramic substrate assembly
- Underfill and encapsulationSMT and PCB assemblySoldering and related electronic assembly processes
Program, troubleshoot, maintain, and optimize automated and semi-automated manufacturing equipment used in microelectronics and electronic assembly.
Develop and optimize manufacturing parameters, process windows, operating procedures, and process controls.
Support process development, qualification, validation, and implementation of new microelectronic assembly processes.
Evaluate, qualify, and support manufacturing materials including epoxies, adhesives, solders, fluxes, encapsulants, underfill materials, and other electronic/microelectronic process materials.
Perform and/or support wire bond pull testing and other process verification, inspection, and qualification activities.
Analyze process data, yield data, test results, and manufacturing defects to identify root causes and implement effective corrective and preventive actions.
Investigate process and product failures using structured root cause analysis and failure analysis methodologies.
Adjust and optimize manufacturing processes to improve product quality, reliability, throughput, productivity, and yield.
Support new equipment selection, specification, installation, qualification, validation, calibration, and production implementation.
Develop, present, and obtain approval for capital equipment purchases and manufacturing equipment upgrades.
Develop and maintain manufacturing documentation, including process specifications, work instructions, procedures, process-control documentation, and technical reports.
Provide hands-on technical guidance and troubleshooting support to operators, technicians, and production personnel.
Work closely with Quality and Engineering to investigate nonconformances, manufacturing defects, and process excursions and develop appropriate corrective actions.
Partner with Production to identify and implement opportunities to reduce manufacturing costs, improve efficiency, increase throughput, and optimize manufacturing processes.
Coordinate with outside equipment manufacturers, material suppliers, calibration providers, and other process vendors as required.
Support applicable customer, quality, regulatory, ISO, and Quality Management System requirements.
Ensure manufacturing activities are performed in accordance with applicable Environmental Health & Safety requirements.
Support site-wide 6S, Lean, and continuous improvement initiatives.
Required Knowledge, Skills & Abilities:
Strong hands-on knowledge of microelectronics and hybrid assembly manufacturing processes.
Hands-on experience with epoxy dispense, die attach, wire bonding, and wire bond pull testing.
Experience supporting high-reliability microelectronic or hybrid assemblies.
Experience developing, troubleshooting, and optimizing microelectronics manufacturing processes and equipment.
Understanding of die attach materials, bonding processes, adhesives, epoxies, and related microelectronics process materials.
Ability to analyze process parameters, test results, yield data, and manufacturing defects and translate findings into sustainable process improvements.
Strong root-cause analysis, failure-analysis, corrective-action, and continuous-improvement capabilities.
Ability to develop and maintain manufacturing process documentation, specifications, procedures, and work instructions.
Ability to work effectively with operators, technicians, Production, Engineering, Quality, Supply Chain, management, and external vendors.
Ability to provide hands-on production-floor support in a fast-paced, high-reliability manufacturing environment.
Strong analytical, technical troubleshooting, communication, and problem-solving skills.
High-Reliability Microelectronics Standards:
Candidates should have experience with or working knowledge of applicable high-reliability microelectronics requirements, including:
- MIL-STD-883 – Microelectronics test methods and proceduresMIL-PRF-38534 – Hybrid microcircuits
- Class H and Class K requirementsMIL-PRF-38535 – Integrated circuitsMIL-PRF-19500 – Semiconductor devices
- Experience applying these requirements within aerospace, defense, military, space, or other high-reliability manufacturing environments is strongly preferred.
- Experience in Several of the Following Areas is Highly Desirable:
- Flip-chip assemblyHybrid microelectronic assemblyCeramic substrates
- Underfill and encapsulation
- Semiconductor packaging
- Fine-pitch and high-density electronic assemblySMT and PCB assemblySoldering and lead-free manufacturing
- Automated inspection and process-verification equipment
- Process qualification and validation
- Equipment qualification and calibration
- Statistical process control and Cpk analysis
- Lean, Six Sigma, DOE, 6S, or related continuous-improvement methodologies
- EducationBachelor's degree in Engineering, Science, Mathematics, or a related technical discipline.
