We are seeking a Packaging Engineer to lead end-to-end packaging development for advanced microelectronic and RF communication products. This role is responsible for planning, designing, and delivering innovative packaging solutions across a range of technologies, including integrated circuits (ICs), system-in-package (SiP), sub-assemblies, and modules. You will own the full packaging lifecycle-from concept and definition through design, modeling, testing, and production release-while partnering closely with cross-functional engineering teams and external vendors. This position requires deep technical expertise in semiconductor packaging, strong problem-solving skills, and the ability to drive development in a fast-paced, high-reliability environment.
Responsibilities:- Collaborate with product development teams (RFIC, MMIC, and module engineering) to design and deliver next-generation packaging solutions for RF communication systems
- Define package architectures, materials, and processes that meet performance, reliability, manufacturability, and cost requirements
- Lead packaging efforts for new product introductions (NPI) and new technology development
- Develop and manage packaging documentation, including statements of work (SOWs), drawings, and process flows
- Design and layout semiconductor packages such as QFN, SiP, WL-CSP, RDL, Flip Chip, FO-WLP, and interposers
- Utilize modeling and simulation (thermal, mechanical, electrical) to ensure early-stage design success
- Provide technical oversight to external vendors and manufacturing partners throughout package fabrication
- Apply expertise in assembly processes (die attach, wirebond, bumping, overmolding) to guide design decisions and troubleshoot issues
- Evaluate and recommend packaging solutions through feasibility studies for new products
- Partner with engineering teams to optimize packaging for cost and performance
- Define and oversee reliability testing to ensure product robustness and compliance
- Coordinate cross-functional efforts across design, test, quality, manufacturing, and supply chain teams
- Identify and resolve material and process challenges during development
- Manage packaging projects using industry-standard tools and methodologies
- Contribute to long-term packaging technology roadmaps and support proposal efforts
Qualifications:- 10+ years of experience in semiconductor packaging, including package engineering, assembly processes, and reliability
- Bachelor's degree in Electrical, Mechanical, Materials Engineering, or a related technical field
- Strong understanding of microelectronic packaging, including mechanical, electrical, and thermal performance considerations
- Solid foundation in heat transfer and material properties
- Experience supporting RFIC, millimeter wave, SiP, or module-based products
Hands-on experience with package design technologies such as QFN, SiP, BGA, WL-CSP, Flip Chip, bumping, or FO-WLPKnowledge of semiconductor assembly processes, including die prep, die attach, wirebonding, flip chip, and SMTFamiliarity with interconnect reliability testing (e.g., daisy chain, CPI, BLR)
Understanding of metallization schemes for laminates, interposers, and SMTExperience with statistical analysis and design of experiments (DOE)
Ability to operate independently and drive technical decisions in ambiguous environments
Strong communication and collaboration skills across cross-functional teams
Experience translating system or IC requirements into packaging solutions
Additional Requirements: U.S. Citizenship required Ability to travel up to 10%
