Thermal Engineering Technical LeaderCisco is seeking a Thermal Engineering Technical Leader to join a dynamic team focused on developing advanced thermal solutions for high-performance networking and compute platforms. This senior individual contributor role is part of a collaborative environment that drives innovation in liquid and air cooling systems, including cold plates, CDUs, heat sinks, and vapor chambers. The team works closely with hardware design, manufacturing, and supplier engineering groups to integrate robust thermal technologies at scale, contributing to Cisco's next-generation ASIC, optical, and power systems. In this role, you will lead the design, simulation, validation, and production readiness of product-level thermal solutions, both liquid and air-cooled. You will own modeling, simulation, thermal testing, and performance validation workflows, partnering with suppliers, ODMs, and internal teams to evaluate and implement new cooling technologies. Your work will define design parameters, correlate physical testing with simulation models, and collaborate with Cisco hardware design teams to roadmap next-generation thermal strategies. You will also contribute to cross-functional efforts to improve qualification and specification standards, driving innovation and ensuring high-performance system design.
Minimum Qualifications:- BS in Material Science, Mechanical, or Chemical Engineering (MS preferred) or related.8+ years of experience in thermal/mechanical design for electronics
- Direct experience with liquid cooling systems: cold plates, manifolds, pumps, CDUsStrong working knowledge of air-cooled solutions: heat pipes, vapor chambers, TIMsHands-on validation and troubleshooting with thermal data acquisition tools
- Proficient in CFD (Computational Fluid Dynamics) and simulation-to-test correlation
- Quick learner, adaptive in learning through sensing and academic research
Preferred Qualifications:- 10+ years of experience in microelectronics thermal management
- Proven experience productizing liquid cooling solutions, beyond lab or R&D work
- Familiarity with component packaging (BGA, Flip Chip, 2.5D/3D IC)
- Understanding of component and system reliability for thermal subsystems
- Effective communicator with ability to present findings to cross-functional and executive audiences