Skip to main content
Job Description Key Responsibilities: Mixed-Signal Design: Design and develop analog and digital circuits. High-Speed Board Design: Handle routing and layout for DDR3/DDR4, PCIe, and QSPI interfaces with strict impedance control. Power Tree Architecture: Design complex DC-DC power management networks using buck and boost regulators, LDO regulators, and power sequencing. Processor & FPGA Design: Develop systems using ARM Cortex-M, RISC-V, microcontrollers, advanced microprocessors, and FPGAs. Signal Integrity & EMI/EMC: Mitigate noise, crosstalk, and electromagnetic interference to meet FCC, CE, automotive, and aerospace standards. Communication Protocols: Work with I2C, SPI, UART, RS485, CAN, USB, and Ethernet interfaces. Lab Verification: Use digital storage oscilloscopes (DSO), logic analyzers, vector network analyzers (VNA), and spectrum analyzers. Root-Cause Analysis: Perform component-level troubleshooting, derating analysis, and thermal management. Technical Leadership: Mentor engineers, lead design reviews, and coordinate with firmware, mechanical, and software teams. Project Management: Prepare architectural trade-off analyses, component selection matrices, project schedules, and budgets. Schematic & PCB Design Tools: Demonstrate proficiency with enterprise EDA tools, particularly Xpedition.
Required Skills: Mixed-signal, analog, and digital circuit design. High-speed PCB design and routing. DDR3/DDR4, PCIe, and QSPI interfaces. Power management and DC-DC converters. ARM Cortex-M, RISC-V, and FPGA ecosystems. Signal integrity and EMI/EMC compliance. Communication protocols and laboratory instrumentation. Component-level debugging and root-cause analysis. Xpedition EDA tools.

Matching similar jobs

Level

Lead L6

Location

Dublin, OH

Occupation

Electronics Engineers, Except Computer

Industry

Printed Circuit Assembly (Electronic Assembly) Manufacturing

Posted

2 days ago

APPLY NOW (opens in a new tab)