Job Description:
Job Description ABOUT THE COMPANYWe are a Silicon Valley, San Jose based stealth start-up and are looking for a passionate, ambitious individual who shares our vision of next generation disruptive memory solutions for Agentic AI inference and high performance data center computing applications. This is an impactful and senior leadership role allowing you to mastermind the realization of our strategic ambitions and shape the direction of our product portfolio development.
ABOUT THE ROLE:
This is a senior leadership role for manufacturing enablement of our disruptive product which is a purpose-built memory for AI inference computing. As the Vice President of Manufacturing you will lead the enablement of the road to manufacturing, lead manufacturing strategic scoping of manufacturing partnerships, negotiate supply chain agreements, and be responsible for our global fab operations and supply chain execution for our memory product lines.
CORE RESPONSIBILITIESFab & Production Leadership: Oversee high-volume semiconductor fabrication plants, assembly, test, and packaging operations across global sites. Define a winning manufacturing strategy based on a deep understanding of our specific materials, device and memory type.
Yield & Quality Optimization: Drive continuous improvement in wafer/die yields, defect reduction, test coverage, reliability metrics and cost competitiveness.
CapEx & Technology Roadmaps: Own multi-million-dollar capital expenditure budgets for cleanroom expansion, lithography/etch equipment upgrades, and next-gen node transitions.
Executive Collaboration: Partner with the CEO, CTO, CCO and technology teams to align fab strategies and output with market demand, product lifecycles, and customer commitments.
Supply Chain & Risk Management: Manage strategic foundry/supplier relationships, raw material security (silicon wafers, specialty gases), and emergency crisis responses.
Compliance & Safety: Enforce strict cleanroom safety protocols, environmental regulations, and corporate governance.
REQUIRED QUALIFICATIONS & SKILLS
Education:
Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, or Industrial Engineering.
Experience:
15+ years of progressive executive or senior leadership experience in semiconductor manufacturing, operations, or process/device engineering. At least 7+ years of prior experience at leading memory IDMs or semiconductor foundries is required. Ability to bring up new products and scale up to high volume manufacturing (HVM) is preferred.
Domain Expertise: Deep technical mastery of memory devices, technology products and associated manufacturing trade-offs and cleanroom/foundry dynamics.
Financial Acumen: Proven P&L (Profit and Loss) management and large-scale CapEx justification experience.
Leadership Skills: Track record of managing global operations, scaling global engineering teams, and driving continuous manufacturing improvement cultures.
