Job TitleTo support new customer ramp up plan for SIPHOG production 2027 in clean room advance packaging assemblies (D/A W/B)
Principal Accountabilities / Duties:
Develop and optimize die attach and wire bond processes for prototype, NPI, and production assemblies in the advanced packaging cleanroom.
Create and qualify machine/process recipes for die bonder, wire bonder, plasma cleaner, epoxy dispenser, and active optical alignment equipment.
Create, improve and document optical splicing and routing for fiber optics box build assembly.
Lead root cause analysis and corrective actions for process excursions.
Establish inspection criteria, acceptance procedures, and metrology methods for optical and photonic sub-assemblies.
Design and order necessary tooling and ensure availability of all consumables
Previous Experience Required:
Education or Training: BS degree required in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, Optical Engineering, or Physics.
Preferred Qualifications:
(nice to have skills): 0-1 year experience in cleanroom manufacturing environment. Understand principle for die bonding in microelectronics. Basic Programming python, Excel for data analysis
