Senior Manufacturing Engineer - Thin Film Engineering (PVD, PECVD, ALD & RIE)

Senior Manufacturing Engineer (IC) Ensurge Micropower is a pioneer in solid-state microbattery technology, enabling the next generation of intelligent, connected devices. Leveraging proprietary thin-film and roll-to-roll manufacturing, Ensurge delivers safe, high-energy-density batteries for wearables, health tech, industrial sensing, and defense applications. As our technology transitions from development to production, disciplined manufacturing execution becomes the differentiator.

Define and lock critical process parameters (CPPs) — e.g., chamber pressure, Ar/process gas flow, RF/DC power, substrate bias, deposition rate, film stress and thickness uniformity targets (PVD/PECVD); precursor/co-reactant pulse and purge times, cycle count, growth per cycle (GPC), and substrate temperature (ALD); RF power, gas chemistry (e.g., CF4/O2/Cl2), etch rate, selectivity, sidewall profile/anisotropy, DC bias, and endpoint detection (RIE) Define and lock control limits and OCAPsEnsure processes are robust, stable, and scalable Work with Equipment Engineering to: Define tool requirements (sputter cathodes/targets, PECVD chambers, ALD reactors and precursor delivery systems, RIE/ICP-RIE chambers and endpoint detection systems, RF/DC power supplies, vacuum, gas delivery, and abatement/scrubber systems) Improve reliability and uptime Implement process-driven upgrades Lead tool qualification and process acceptance Ensure equipment supports throughput, precision, and repeatability Own flow from substrate input ? deposition/etch ? downstream handoff to assembly Reduce bottlenecks, WIP, and inefficiencies Improve line balance and production scheduling alignment Support layout and flow improvements as the system scales Partner with Quality to implement: SPC and process control on film thickness, stress, uniformity, and conformality Film characterization (ellipsometry, profilometry, XRD, SEM/AFM, four-point probe) to validate deposition results against CPPsTraceability and data capture Build and maintain: SOPsProcess specs Control plans Ensure manufacturing is data-driven and auditable Lead structured RCA on: Yield loss DefectsDowntimeUse characterization data (SEM, XRD, cross-section imaging) to root-cause excursions Implement sustainable fixes — not workarounds Drive continuous improvement aligned to operational excellence principles (standard work, DMS, etc.)Qualifications Required7–12+ years in manufacturing engineering with thin-film deposition and etch (PVD/sputtering, PECVD, ALD, and/or RIE) in battery, semiconductor, or thin-film industries Proven experience owning manufacturing processes on the floor Strong track record of driving yield and throughput improvements Experience supporting or leading pilot ? production scale-upHands-on mindset — comfortable working directly with equipment, technicians, and operators Working knowledge of thin-film characterization techniques (e.g., ellipsometry, profilometry, XRD, SEM) and their use in validating and controlling deposition processes Preferred Understanding of film stress engineering, plasma physics, RF coupling, and DC self-bias Understanding of plasma etch chemistry, selectivity, anisotropy, and endpoint detection (RIE/ICP-RIE) Familiarity with ALD precursor chemistry, self-limiting surface reactions, and pulse/purge sequencing Vacuum systems and chamber conditioning experience Experience with image-based film/defect characterization (SEM, optical microscopy) and correlating characterization data back to process control limits Experience with MES, traceability systems, or data-driven manufacturing Salary Range: $162,000-$198,000 The base salary range is specific to California. The salary of the final candidate selected for this role will be determined by a variety of factors, including, but not limited to, internal equity, experience, education, specialty, and training.