IBM Research seeks a Silicon Spin Interposer Process Integration Engineer to integrate, optimize, and sustain end-to-end flows for superconducting interposers and advanced wafer-level components in IBM’s silicon spin quantum computing efforts. This role demands hands-on engagement with deposition, etch, lithography, bonding, and finishing processes and collaboration with fabrication, metrology, and packaging teams.

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Level

Lead L6

Salary

$200,000 - $250,000 per year

Location

Yorktown Heights, NY

Occupation

Semiconductor Processing Technicians

Industry

Semiconductor and Related Device Manufacturing

Posted

2 days ago

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