Confidential is seeking a Principal Applications Engineer to join a next-generation Advanced Packaging team, based on-site in Missouri. This hands-on technical leadership role supports cutting-edge packaging technologies for customers in the semiconductor industry. You will lead applications engineering, drive process integration, and provide technical leadership on wafer bonding, RDL, and hybrid bonding. Collaboration with process, equipment, and customer teams will be essential to optimize

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Level

Lead L6

Location

Kansas City, MO

Occupation

Packers and Packagers, Hand

Industry

Semiconductor Machinery Manufacturing

Posted

2 days ago

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