Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Senior Materials Engineer / Scientist in Advanced Packaging Technology Development (APTD), you will help define and enable the materials foundation for Micron's next-generation memory and advanced packaging technologies, including HBM, 3D memory, and heterogeneous integration. You will find, develop, characterize, qualify, and integrate new materials that make new product architectures possible. You'll also improve performance, reliability, manufacturability, scalability, and cost. You will work with materials science, process development, integration, product, manufacturing, quality, and supplier teams to turn scientific insight into technology impact. We're looking for people who question assumptions, look beyond their own field, and stay with hard, ambiguous problems until they're solved. Direct semiconductor experience is valuable but not required. We encourage candidates from other materials-intensive industries and research institutions to apply.
Responsibilities:
Develop, characterize, qualify, and integrate advanced materials for next-generation memory and packaging technologies. Form hypotheses, design and run rigorous experiments, analyze data, and use the results to guide materials and technology decisions. Investigate materials behavior, including interfaces, adhesion, mechanical response, thermal performance, chemical compatibility, reliability, and process interactions. Drive materials development in areas such as: Polymer composites and encapsulation materials, such as NCF, MUF, mold compounds, underfills, and die-attach materials. Temporary bonding and release materials, carrier systems, back-grind and dicing tapes, and other materials for thin-wafer handling. Dielectrics, films and coatings, adhesion and surface preparation materials, thermal materials, and substrate or RDL materials. Emerging material platforms for HBM, 3D memory, and heterogeneous integration. Constructively challenge existing assumptions, specifications, and practices when data supports a better approach. Partner with process, integration, product, manufacturing, quality, equipment, and supplier teams to move materials from concept through qualification and manufacturing readiness. Work with suppliers, universities, research organizations, and other external partners to evaluate new materials technologies and speed up their development. Use modeling, simulation, data analytics, and AI tools to speed up materials development and problem solving. Contribute invention disclosures, patents, technical reports, and publications where appropriate.
Basic Qualifications:
MS or PhD in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Science, Physics, Mechanical Engineering with a strong materials focus, or a closely related field.
Professional or research experience developing, characterizing, qualifying, integrating, or scaling advanced materials technologies. Strong materials science fundamentals, including structure–property–process–performance relationships.
Proven ability to solve complex, multidisciplinary technical problems through experimentation, analysis, and structured problem solving.
Clear technical communication and the ability to collaborate across disciplines, organizations, suppliers, and geographies.
Ability to work independently, build alignment, and deliver results as part of a global team.
Final level will be based on technical depth, demonstrated impact, scope, independence, and relevant experience.
Preferred
Qualifications:
PhD in a relevant technical discipline.
Experience taking a new material, product, process, or manufacturing capability from concept through implementation.
Documented innovation, such as patents, invention disclosures, or publications.
Experience working with materials suppliers, universities, research labs, startups, or industry consortia.
Background in semiconductors, microelectronics, advanced packaging, aerospace, photonics, energy, specialty chemicals, composites, or another technology-intensive materials field.
Hands-on experience with polymer encapsulation, temporary bonding/debonding, thin-wafer handling, or thermal and interface materials.
Experience using AI-enabled tools, modeling, or data analytics to improve technical learning and decision quality.
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
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Summary
Location: Boise, ID - Main Site
Type: Full time
