GlobalFoundries inc. is seeking a Senior Principal Packaging Engineer in Richardson, TX to define the package technology roadmap and lead advanced package design for automotive and industrial applications. You will manage OSAT partners and optimize materials, BOMs, and assembly flows to meet performance, reliability, and cost targets. Requires MS or BS in EE/ME with 15+ years in packaging, expertise in flip-chip, WLCSP and FCBGA, and hands-on use of Cadence, Synopsys, Ansys and HFSS.

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Level

Lead L6

Salary

$171,000 - $296,000 per year

Location

Brooklyn, NY

Occupation

Mechanical Engineers

Industry

Semiconductor Machinery Manufacturing

Posted

2 days ago

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