Senior 3D Heterogeneous Integration Engineer

GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) at Fab8 in Vermont. You will lead 3D-Heterogeneous Integration (3D-HI) initiatives including wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development, driving end-to-end process integration across multiple programs. The role requires a Master's degree in engineering with 5–6 years of related experience, deep BEOL/TSV knowledge, and strong problem-solving and communication skills.