CScale is building the interconnect for gigawatt-scale AI, focusing on integrated optical interconnect and high-speed packaging. The role centers on driving 2.5D/3D packaging development from concept to production and coordinating with OSATs and foundries to ensure reliability and manufacturability. Ideal candidates will have hands-on experience with high-speed interposer-based packaging, cross-functional communication, and program management to meet tight schedules and complex integration
