To support the development of high-performance satellites, the remote Senior ASIC Package Design Engineer will implement advanced ASIC package architecture, focusing on flip-chip BGA and multi-chip module solutions, while collaborating with internal teams and managing vendor relationships.
Key responsibilities:
Define ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up and power delivery
Lead package-level trade studies across performance, power integrity, and manufacturability
Establish package design standards and drive detailed design of high-pin-count ASIC packagesRequired qualificationsBachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field
5+ years of experience in ASIC package design, with expertise in FC-BGA
Proven experience delivering high-pin-count, high-performance ASIC packages into production
Strong understanding of substrate technologies, SI/PI fundamentals, and thermal management
Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS
