Senior Manager, Advanced Packaging Metrology

Intel Corporation in Hillsboro, Oregon seeks an Advanced Packaging Metrology Engineering Manager to lead a high-performing team. You will drive wafer-level packaging innovation, enable manufacturing readiness, and steer long-term technology strategies across global sites. The role requires building strong cross-functional partnerships and mentoring engineers to excel in a fast-paced environment. You will champion safety, quality, and cost while pushing the boundaries of semiconductor technology,