AMD in Austin, TX is seeking a highly skilled CAD engineer to advance 3D-IC and advanced packaging flows from RTL to signoff. You will lead hands-on debugging of large netlists and partner with Synopsys and Cadence on AI-enabled CAD solutions. The ideal candidate combines a strong silicon hardware background with scripting proficiency in Python/TCL/Perl, plus experience applying ML/LLM techniques to CAD workflows. This role emphasizes collaboration across global teams.
