Join Nokia's advanced photonics and semiconductor design team, developing next-generation analog ICs for high-speed optical communication systems. In this role, you will design and lead development of high speed Transmit (TIA) and Receive (MZMD) components for coherent long-haul and metro systems as well as PAM4 data center systems, primarily using SiGe BiCMOS and CMOS processes.
You will play a key role in delivering innovative solutions that enable faster, more efficient data transmission across data centers and telecommunications networks, and emerging AI-driven infrastructure.
Responsible for design and development of Transmit (TIA) and Receive (MZMD) components for optical network systems (Coherent, PAM4, etc.).
Innovate and develop new architecture utilizing advanced process nodes, preparing these processes for subsequent product development.
In charge of many aspects of IC product development, such as design, layout, silicon bring-up and characterization.
Collaborate with product engineering and optical system groups to evaluate, develop, and refine "white box" specifications into detailed electrical specifications for both Tx and Rx components.
Provide significant technical contributions to design reviews, verifying design integrity and adherence to standards.
Work with ASIC group by applying Nokia documentation standards to optimize development cycles.
Offer technical guidance and share best practices in optical network design and development to mentor new hires and junior team members.
Master's (M.S.) or Ph.D. degree in Electrical Engineering with a minimum of 10 years of related experience in Analog/RF ASIC design and development
Demonstrated experience in high-speed Analog/RF IC designs (TIA, MZMD) with SiGe BiCMOS technology
Proven experience in:
Low noise / high linear (>80GHz) broadband analog circuits for optical front-end
High-precision analog circuits (e.g., linear regulators, bandgaps, DAC/ADC).
Deep understanding of detailed transistor-level design, device physics, and control/feedback loop stability analysis
Knowledge of transmission lines and other high-frequency passive structures
Strong understanding of package and board-level design optimization
Experience with RF wafer probing, lab equipment, and evaluation of high-speed analog ICs
Demonstrated ability to independently resolve complex organizational and technical challenges
Solid expertise with EDA CAD tools, custom analog layout, 3D EM modeling
Strong problem-solving and decision-making capabilities
Highly- self-motivated, detail-oriented, and results-driven
Must be a team player with good verbal and written communication skills
