Frore Systems, an innovative top tier VC backed startup in Silicon Valley, CA, has developed a disruptive solid-state active cooling solution, AirJet, based on flexible micro-electromechanical systems (MEMS). AirJet by Frore Systems is the world's first solid-state active cooling chip, delivering >2x improvement in performance of ultra-compact, silent, dustproof, water-resistant and vibration free devices. In a world where almost every device we own needs increasing power, heat is an enduring challenge. The problem is rapidly escalating as technology advances, AI accelerates, and users demand more speed and convenience in smaller and smaller devices which generate more and more heat. The markets that benefit from Frore Systems solid-state active cooling chips are numerous, they range from the edge applications - Notebooks, Tablets, mini-PCs, gaming devices, action cameras, VR, AR, SSD accessories, Smartphones, LED lighting, Industrial edge gateways, Industrial PCs, Security cameras, Dashcams, etc. - to Hyperscaler and Automotive applications. We are in the unique position of being first to market with an innovative solution to a large and rapidly growing industry challenge. And we are poised to scale up!
Role Summary:
We are looking for aSenior Thermal Engineerwith a deep understanding ofconsumer electronicsand data center thermal design and cooling technologies to lead the development of next-generation compute platforms using Frore's AirJet technologies. You will drive end-to-end thermal architecture across consumer electronics platforms, servers and racks, ensuring scalable, energy-efficient, and reliable cooling.
Key Responsibilities:
Thermal Architecture Leadership : Drive thermal cooling strategies for consumer electronics devices, to meet performance, efficiency, and reliability goals using AirJet technologies. CFD and System Modeling : Lead airflow and thermal simulations using CFD tools at component, system levels. Optimize custom thermal solution, flow paths, heat sinks, ducting designs. Thermal Validation and Testing : Guide thermal validation plans, including the use of IR thermography, thermocouples, pressure drop measurements, and flow behavior from acoustics perspective. Reliability and Margin Analysis : Perform thermal margin analysis and ensure compliance with derating guidelines, component lifetime requirements, and ASHRAE standards. Mentorship : Mentor junior engineers, review their designs and analyses, and help scale best practices across the organization. Cross-Functional Integration : Collaborate closely with R&D and manufacturing to ensure high quality thermal modules to customers
Required Qualifications:- B.S. in Mechanical Engineering, Thermal Sciences, or related field.
- M.S./PhD. Preferred.5+ years of hands-on experience in thermal design of high-power electronics or data center systems.
- Expertise in CFD tools: Ansys Icepak, Fluent, or equivalent.
- Deep understanding of heat transfer and fluid dynamics, including conduction, convection (forced and natural), and phase change cooling.
- Strong track record of bringing complex cooling solutions to production, with thermal ownership.
- Additional Skills:
- Strong technical communication and ability to present to customers, executive audiences and cross-functional teams.
- Proven leadership in cross-functional engineering projects.
- Proactive problem-solver who thrives in a fast-paced environment.
Compensation:
Depending on experience and skills, the expected starting base salary is $140,000 - $220,000 USD per year, plus equity. The actual salary will be based on various factors unique to each candidate including skill set, relevant experience, qualifications, location, position level, and other job-related reasons.
