Lead 2.5D/3D Packaging for AI Data Centers

Phizenix Inc. seeks an Advanced 2.5D/3D/Chiplet packaging Lead to direct Signal Integrity for package, PCB and system design for copper interconnects beyond 200G. Lead 2.5D/3D and heterogeneous packaging development for co-packaged driver, TIA and optical engines, including substrate architecture, interposer evaluation, and die–package co-design. Own OSAT/substrate supplier strategy, PDN and thermal design, and signoff criteria.