TopoLight is a venture-backed deep tech startup commercializing novel high-power photonic crystal lasers (PCSELs).We're looking for a principal engineer who will own the packaging of our laser module. You'll take a high-power laser die from concept to a manufacturable, taped- out package. You'll own the thermal path, the die-attach and bonding strategy, and the integration that determines whether the device meets its wavelength, efficiency, and reliability targets, and drive it through assembly and characterization to make it real.
Note:
This job posting was placed by Liminal, we're the venture builder that is backing TopoLight.
Responsibilities:- Own the laser package architecture from concept through tape-out
- Design the thermal path, from die-attach to the submount, heat-spreader and cooler
- Translate device performance targets into a manufacturable package that holds emission wavelength and efficiency across the range of operation
- Model the thermal and mechanical behavior of the device and correlate against measured junction temperature, wavelength, and rollover
- Debug and iterate problems quickly in a fast-moving environment
Qualifications:- B.S. or M.S. in EE, Materials Science, Physics, Mechanical or Optical Engineering, or equivalent, with hands-on laser or optoelectronic packaging experience
- Demonstrated experience packaging high-power CW semiconductor lasers
- Has taken at a laser die from concept to a taped-out, working package
- Solid understanding of how thermals impact and drive laser behavior
- Comfortable owning ambiguous problems in a startup environment
- Strong written and verbal communication, with a collaborative working style
CompensationAs a principal engineer, you will receive a significant stake of equity in TopoLight. Salary willrange from $135k - $165k based on experience, with a large stock allotment.