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Senior Thermal Architect for AI Compute & Packaging at qualcomm |...

Senior Thermal Architect for AI Compute & Packaging

qualcommSan Diego, CA

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Senior Thermal Architect for AI Compute & Packaging

qualcommSan Diego, CALead L6

Mechanical Engineers Engineers, All Other Computer Hardware Engineers

Air-Conditioning and Warm Air Heating Equipment and Commercial and Industrial Refrigeration Equipment Manufacturing Heating Equipment (except Warm Air Furnaces) Manufacturing Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)

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Qualcomm Technologies, Inc. in San Diego is seeking a Principal Thermal Engineer to solve complex thermal challenges across the Dragonfly AI300 platform. You will lead thermal architecture, CFD simulations, and cross-functional collaboration to optimize performance, efficiency, and reliability from concept to production. The role requires advanced degrees with 2+ years minimum experience in system/package design or related work, and hands-on skills in thermal testing and model validation.

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Level

Lead L6

Location

San Diego, CA

Occupation

Mechanical Engineers

Industry

Air-Conditioning and Warm Air Heating Equipment and Commercial and Industrial Refrigeration Equipment Manufacturing

Posted

3 days ago

APPLY NOW (opens in a new tab)