Process Engineer

Department: R&DPosition Type : Full-Time

Salary Range: $160,000 - $200,000 Working Schedule:9:00-18:00

Location: Hillsboro, Oregon

Company Overview: A Japanese semiconductor equipment company supporting customers in the United States through sales, engineering, and technical services. The company provides equipment and process solutions used in semiconductor wafer manufacturing.

Position Summary: We are seeking a highly motivated Wet Process and Applications Engineer to support integrated process development for advanced logic and memory devices, from laboratory development through fab implementation. This role requires a strong understanding of integrated semiconductor manufacturing process flows and the ability to apply metrology techniques and design of experiments (DOE) to solve customer process challenges and develop solutions suitable for high-volume manufacturing.

Responsibilities: Lead onsite process development engagements with customer R&D engineering teams. Collaborate with partners and service engineers to identify, document, and propose future hardware and process requirements to the development team in Japan. Develop and improve wet cleaning and wet etching applications using single-wafer and batch processing equipment. Conduct laboratory experiments to identify solutions to customer processing challenges. Prepare clear technical status reports for customers and internal technical and executive management teams. Identify equipment and process solutions that address customer needs and communicate recommendations to customer engineering and sales teams. Support sales and sales support teams through regular customer meetings and technical reviews. Travel within the United States and to Japan for wafer demonstrations and internal meetings. Travel is expected to be less than 10%.

Required Qualifications: At least three years of relevant wet process engineering experience in an R&D role at a semiconductor device manufacturer or semiconductor equipment manufacturer. Strong understanding of wet cleaning, wet etching, process integration, and related applications. Understanding of complex, integrated semiconductor manufacturing process flows. Ability to use metrology techniques and DOE in a laboratory environment to investigate process challenges. Clear and effective communication skills, including the ability to explain technical findings to different audiences. M.S. or Ph.D. in Engineering, Chemistry, Materials Science, or Physics.

Preferred Qualifications: Familiarity with the hiring company's single-wafer processing equipment. Japanese language skills. Training on the company's equipment and processes will be provided.