Senior ASIC Design Engineer – ML Chips & 2.5D Packaging
amazonAustin, TX
Senior ASIC Design Engineer – ML Chips & 2.5D Packaging
amazonAustin, TXLead L6
Computer Hardware EngineersElectronics Engineers, Except ComputerComputer Systems Engineers/Architects
Electronic Computer ManufacturingSemiconductor and Related Device ManufacturingComputer Systems Design Services
APPLY NOW (opens in a new tab)Annapurna Labs (U.S.) Inc. in Austin, TX seeks an experienced ASIC engineer to define, design and validate AWS next generation ML chips, cards and server integration. You will work across HBM, memories and Serdes, coordinate with vendors, write tests, review designs, and participate in code reviews and cross-functional planning to deliver the next generation ML chip and its 2.5D packaging in a demanding AWS datacenter environment.
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Level
Lead L6
Location
Austin, TX
Occupation
Computer Hardware Engineers
Industry
Electronic Computer Manufacturing
Posted
yesterday