Director High Performance Computing Power Modules

Job Location: This position will be filled near our Vishay offices in San Jose, CA.

What you will be doing: Technology & Product Strategy* Develop and execute the long-term HPC power module technology and product roadmap aligned with market and customer requirements.* Identify emerging trends in AI, HPC, data centers, GPU/CPU power delivery, networking, and power architecture.* Define product strategies addressing increasing requirements for higher current, higher power density, improved thermal performance, lower losses, and increased efficiency.* Drive technology differentiation through innovative module architecture, semiconductor integration, advanced packaging, interconnects, and thermal solutions.* Establish technology partnerships and development strategies with key customers, semiconductor suppliers, technology partners, and internal R&D organizations. Product Development* Lead development of next-generation power modules from concept through qualification, production release, and market adoption.* Establish product requirements, technical specifications, development schedules, and performance targets.* Direct cross-functional engineering teams responsible for:+ Power semiconductor technologies+ Module/package design+ Electrical and thermal design+ Mechanical design+ Materials and interconnect technologies+ Reliability and qualification+ Manufacturing and process development+ Application engineering* Ensure products achieve targeted performance, cost, quality, reliability, and time-to-market objectives.* Establish design-for-manufacturing and design-for-reliability principles throughout the development process. HPC & Data Center Applications* Develop a strong understanding of evolving AI accelerator, GPU, CPU, server, and data-center power architectures.* Engage directly with strategic customers to understand future power requirements and influence next-generation system designs.* Support customers in defining power module architectures and performance requirements.* Identify opportunities for advanced power modules in:+ AI servers+ GPU/accelerator platforms+ High-performance computing+ Data-center power systems+ Networking and communications+ Cloud infrastructure+ High-current processor power delivery* Translate system-level customer requirements into module-level electrical, thermal, mechanical, and reliability specifications. Technical Leadership* Serve as a senior technical authority for HPC power module technology.* Provide technical direction on semiconductor selection, module architecture, thermal management, packaging, and system integration.* Drive innovation in areas such as:+ High-current power modules+ Low-inductance designs+ High-frequency switching+ Advanced thermal management+ High-density packaging+ Advanced interconnect technologies+ Si, SiC, GaN, and other emerging semiconductor technologies* Evaluate emerging technologies and determine their potential commercial application.* Lead technology reviews and provide recommendations to executive leadership. Organizational Leadership* Build, lead, and develop a high-performing global engineering organization.* Establish organizational capabilities required to support rapidly evolving HPC and AI markets.* Recruit, mentor, and retain high-caliber technical talent.* Establish clear objectives, accountability, development plans, and performance expectations.* Promote a culture of innovation, collaboration, urgency, and continuous improvement.* Develop technical leaders and succession plans within the organization. What you will bring along:* Bachelor's degree in Electrical Engineering, Power Electronics, Materials Science, Mechanical Engineering, or related technical discipline.* Advanced degree preferred.* 15+ years of relevant experience in semiconductor, power electronics, power modules, advanced packaging, or related technology.* Demonstrated experience leading complex product development organizations.* Strong technical understanding of power semiconductor devices and power module technologies.* Experience with high-power or high-current applications.* Experience with advanced semiconductor packaging and thermal management preferred.* Demonstrated experience working directly with major customers and technology partners.* Strong understanding of product development processes from concept through production.* Proven ability to lead global, cross-functional engineering organizations.

Preferred Technical Experience: Experience in several of the following areas is highly desirable:* HPC / AI / data-center power applications* GPU and CPU power delivery* Power modules and integrated power solutions* MOSFETs, IGBTs, SiC, and/or GaN* High-current DC/DC power conversion* Voltage regulator modules (VRMs)* Power stages and multiphase architectures* Advanced semiconductor packaging* Thermal management and cooling technologies* Electrical and thermal simulation* High-frequency switching* Low-parasitic/low-inductance module design* Reliability qualification* Automotive, industrial, or data-center power electronics* High-volume semiconductor manufacturing What can we offer you for your talent: Vishay offers a comprehensive suite of benefit programs including health care coverage, financial support programs and other resources designed to help you achieve your personal and professional goals. With us, you'll experience unique career paths, an open and collaborative culture, a stable business that will be there for you, and opportunities to work globally and locally. Do you have the skills we need? Are you ready to power your career as you power the world? If so, apply today.