Director of Engineering - Semiconductor Photonics

Position Summary: The Director of Engineering provides technical direction and people leadership for YST's compound semiconductor photonics engineering activities. This role guides semiconductor laser and photodiode development, fabrication process integration, manufacturing engineering, and chip characterization and testing to support optical technologies for AI infrastructure, data centers, and next-generation networks. The Director translates business and product priorities into engineering plans, develops engineers and technical leaders, and helps move technologies from research and development into repeatable manufacturing. The role combines technical judgment with responsibility for team growth, engineering execution, product performance, and continuous improvement. Develop engineering roadmaps, priorities, milestones, staffing plans, and resource recommendations aligned with YST's business goals. Lead technical reviews and resolve engineering tradeoffs involving device performance, manufacturability, reliability, cost, and schedule. Coordinate work across device, process, equipment, and test engineering; establish clear ownership and communicate progress, risks, and decisions to leadership. Device Development & Process Integration: Provide technical leadership for InP and GaAs semiconductor lasers and photodiodes, including DFB, EML, VCSEL, PD, and APD technologies, as applicable to YST's product roadmap. Guide device and process development through understanding of semiconductor materials, epitaxial structures, optical and electrical behavior, and fabrication interactions. Lead engineering problem solving across relevant fabrication steps, including lithography, etching, deposition, metallization, passivation, and device finishing; coordinate specialist expertise where needed. Partner with Operations and engineering teams on process transfer, equipment qualification, manufacturing readiness, and production ramp activities. Chip Testing & Product Reliability: Direct wafer-level and die-level characterization, test methods, test limits, and data analysis to verify laser and photodiode performance. Guide evaluation of relevant characteristics such as laser threshold current, optical output power, wavelength and spectral behavior, detector responsivity, dark current, breakdown behavior, and bandwidth. Ensure test repeatability, calibration, traceability, and correlation between development and production measurements; support test automation and throughput improvements. Partner with Quality and engineering specialists on qualification, burn-in and accelerated life testing where appropriate, failure analysis, and corrective action. Connect chip performance to customer applications and coordinate technical support for product integration and application-related issues. Manufacturing Improvement & Engineering Systems: Use design of experiments, statistical process control, and structured root cause analysis to improve yield, process capability, consistency, and cost. Establish engineering documentation, review practices, process specifications, and change controls that support reproducible manufacturing and technology transfer. Recommend engineering equipment, software, and capital investments based on technical need, capacity, business value, and available resources. Partner with Operations, Facilities, EHS, Quality, and suppliers to support safe engineering work, effective tool deployment, and resolution of technical issues. Build and grow the engineering organization through workforce planning, recruiting, onboarding, and development of technical and leadership capabilities. Coach and mentor early-career engineers; establish training plans, technical knowledge sharing, and opportunities for increasing responsibility. Set clear expectations, provide regular feedback, and manage performance and development for assigned direct reports. Create a collaborative environment that encourages sound technical debate, accountability, timely escalation, and practical problem solving. Communicate effectively with executive leadership, engineers, manufacturing teams, customers, and external technical partners.

Required Qualifications: Master's degree or Ph.D. in Physics, Electrical Engineering, Optoelectronics, Materials Science, or a closely related discipline.8+ years of relevant industry experience involving compound semiconductor lasers, photodiodes, or closely related optoelectronic devices, including development, fabrication, manufacturing engineering, or industrial research and development.5+ years of experience leading engineering teams, including direct people management, mentoring and developing engineers, setting technical priorities, and accountability for engineering execution. Demonstrated ability to build team capabilities and coordinate work across device, process, equipment, and test engineering. In-depth knowledge of InP and GaAs device technologies, including DFB lasers, electro-absorption modulated lasers (EMLs), vertical-cavity surface-emitting lasers (VCSELs), photodiodes (PDs), and avalanche photodiodes (APDs).In-depth knowledge of laser chip manufacturing, optical and electrical testing, and end-use applications; ability to connect device behavior with fabrication and test results. Strong analytical judgment, technical communication, cross-functional collaboration, and ability to explain complex issues to technical and nontechnical audiences.

Preferred Qualifications: Experience transferring semiconductor photonics technologies from development into production and supporting manufacturing scale-up. Experience with optical communications, data center interconnects, or other high-speed optoelectronic applications. Experience with engineering hiring, direct people management, resource planning, and development of technical leaders. Experience with process integration, yield improvement, reliability qualification, failure analysis, and automated chip testing. Experience collaborating with external foundries, epitaxy suppliers, packaging partners, equipment vendors, or international engineering teams. This is a full-time position based 100% onsite in Vancouver, Washington. Work takes place in office, laboratory, and semiconductor manufacturing environments, including cleanroom areas as needed. Occasional work outside normal business hours may be required to support engineering milestones, manufacturing issues, or collaboration with international technical partners. The full base salary range for this position is $170,000–$240,000 annually, with an anticipated starting salary of $170,000–$220,000 annually. Starting pay is based on relevant experience, education, qualifications, compound semiconductor and photonics expertise, engineering leadership experience, and internal equity. Medical, dental, and vision insurance: YST pays 100% of employee-only premiums and 25% of eligible dependent premiums. Employer-paid life insurance; long-term disability insurance; 401(k) retirement plan with an employer match of up to 3% of eligible compensation.

Paid time off: Accrual starts at 12 days annually, increasing to 15 days annually after one year of service. YST also provides six paid holidays, two floating holidays, and paid sick time accruing at one hour for every 40 hours worked, separate from PTO.Complimentary onsite wellness and recreation amenities, including a 24-hour gym, yoga classes, basketball and pickleball courts, available to all employees at no cost. YST Semiconductor Technology Corporation is an equal opportunity employer. We consider qualified applicants without regard to disability, protected veteran status, or any other characteristic protected by applicable federal, state, or local law. YST prohibits unlawful discrimination, harassment, and retaliation. To request a reasonable accommodation during the application or interview process, contact hr@yst-semiconductor.com., This description summarizes the role's primary responsibilities; duties may evolve as business needs change.