Senior Multi‑Die Packaging Engineer for AI Accelerators

delos dataPalo Alto, CASenior L5

$180,000 - $270,000 per year

Computer Hardware Engineers Electronics Engineers, Except Computer Computer Systems Engineers/Architects

Semiconductor and Related Device Manufacturing Semiconductor Machinery Manufacturing Electronic Computer Manufacturing

Delos Data Inc. is seeking a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for AI accelerators. You will own package architecture, substrate design, manufacturability, and engage with vendors such as TSMC/OSAT to enable next-gen products. You will collaborate with IC design and board teams to ensure system-level package requirements are met, evaluate new packaging technologies, and support bring-up, failure analysis, and qualification.

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Level

Senior L5

Salary

$180,000 - $270,000 per year

Location

Palo Alto, CA

Occupation

Computer Hardware Engineers

Industry

Semiconductor and Related Device Manufacturing

Posted

2 days ago

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