Senior Process Engineer | $160,000–$190,000 + Equity | Hybrid | San Diego, CAA rapidly growing photonics technology company is developing next-generation optical products for AI, data centre and high-performance computing applications. We’re looking for a Senior Process Engineer with strong hands-on experience in advanced packaging and manufacturing processes, particularly Flip Chip and Thermo-Compression Bonding (TCB).
What you’ll be doing:
  • Develop and optimise optoelectronic assembly processes
  • Lead Flip Chip and TCB process development
  • Support 2.5D/3D packaging integration
  • Work with suppliers and manufacturing partners to scale processes
  • Design and execute DOE to improve yield and performance
  • Monitor process health, including yield and failure Pareto trends
  • Develop SOWs and project plans for new process development
What we’re looking for:
  • 5+ years' experience in manufacturing/process engineering
  • Strong expertise in Flip Chip and Thermo-Compression Bonding
  • Experience with 2.5D/3D packaging and reliability challenges
  • Experience with DOE, Gage R&R and statistical analysis using JMP, Minitab or similar
  • Experience with FMEAUnderstanding of optoelectronic devices and packaging reliability
  • Knowledge of microelectronics/photonics packaging processes
  • Bachelor's degree in Engineering, Physics or a related discipline
  • Comfortable working in a fast-paced, high-growth environment
This is an opportunity to join an ambitious and growing technology business working on advanced products at the intersection of photonics, semiconductors and high-performance computing.
Location: San Diego, CA – Hybrid
Salary: $160,000–$190,000 + Equity + Full Benefits Package

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