Senior Power Packaging Engineer (SiP/Flip-Chip)

Renesas Electronics Corp. is seeking an experienced packaging engineer to design and develop power SiP/module interconnects, including wafer level packaging and flip-chip techniques. This role will qualify materials, processes, and OSAT/CM partners, collaborating with Product and Reliability teams to ensure timely, high-quality production. You will establish robust production controls, drive DOE campaigns, and support packaging roadmaps for automotive, industrial, and consumer applications in a