Photonics Packaging Integration Engineer (2.5D/3D)

GlobalFoundries U.S. INC. seeks a hands-on assembly integration professional to deliver electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D/3D modalities. The role focuses on tool-process interactions for SiPh Flip Chip assembly, emphasizing product and module reliability, packaging design rules, materials selection, and reliability qualifications for chiplet/module packages.